| Laminate Material | Base Material | FR-4 TG135, TG150, TG170 | |
| CEM1 | |||
| CEM3 | |||
| Rogers 3, 4 and 5 series | |||
| Arlon | |||
| Nelco 4000-13 | |||
| Alμminμm - 2 L | |||
| Ceramic | |||
| Kapton - Samples Only | |||
| Material Thickness | 3~240 mil( 0.076 mm ~ 6 mm ) | ||
| Max. finished board size | 457 x 533mm( 18" X 21") - Mass-Production | ||
| 355.6 x 736.6 mm ( 14" X 29") - Samples | |||
| Min. board Thickness | 4mil. (0.1mm)-2L | ||
| 14mils ( 0.4 mm ) - 4 L | |||
| 24mils( 0.6 mm ) - 6 L | |||
| Max. / Min. Layer | 1 ~ 20L - Mass-Pro. | ||
| 20 ~ 26 L - Samples | |||
| Cu. Thickness | 0.5 ~ 6 Oz - Mass-Pro. | ||
| 0.3 oz - Samples | |||
| Pattern Design | Min. Line-width | 4 mils ( 0.10 mm ) - Mass-Production. | |
| 3 mils ( 0.076 mm ) -Samples | |||
| Min Spacing | 4 mils ( 0.10 mm ) - Mass-Production. | ||
| 3 mils ( 0.076 mm ) -Samples | |||
| Image Distortion | (+/- 20%) | ||
| Gold Thickness Range | 3~50μ" | ||
| Open / Short | YES | ||
| Bow & Twist | < 0.75% | ||
| Solder mask | Type Available | Taiyo, Tamura, Onstatic, glossy, matte | |
| Green, Black, Blue, Red, White, Purple, Clear | |||
| Solder mask Registration tol. | +/-3 mil | ||
| Min.Width S/M Bridge | 4 mil | ||
| PeelableMask | PeelableMask Type | Peters SD2955, SD2954,SD2952 | |
| PeelableMask Thickness | >200μm | ||
| Tolerance | Routing | +/- 0.005" | |
| eature to Hole | +/- 4 mil | ||
| Hole to Hole | +/-3 mil | ||
| Punching | +/-4 mil | ||
| V-Cut | V-grove Depth | +/-10% | |
| Min. Unit / Panel size | 100 mm | ||
| Min. Unit / Panel thick | 3.2 mm | ||
| Surface Treatment | HASL Thickness Range | 80~1000 μm | |
| Entek Thickness Range | 0.2~0.3 μm | ||
| Electroless Nickel Thickness | 100~200 μ" | ||
| Electroless Gold Thickness | 2~10μ" Max | ||
| Wire Bonding Gold Thickness | 5~10μ"Max | ||
| Lead Free HASL | 80~1000 μm | ||
| Immersion Silver | 6 ~12 μ" | ||
| Immersion Tin | 30~40 μ"( Include copper ) | ||
| 15~20 μ" ( Tin only ) | |||
| Flux Thickness Range | none | ||
| Carbon Print Thickness | per resistor request | ||
| Carbon Print Res. | per request | ||
| Drilling | Min. Final Hole Size | 8 mils ( 0.2 mm ) - Mechnical | |
| Size | 4 mils ( 0.1 mm ) -Laser Drill - Samples | ||
| Hole size tol. | PTH ±3 mil | ||
| NPTH ±2 mil | |||
| Hole location tol. | +/-3 mil | ||
| Layer to layer | +/-3 mil | ||
| Registration tol. | |||
| Fiducial Mark Tolerance | +/-20% | ||
| Board flatness Tolerance | < 0.75% | ||
| Special Requirement | poxy In Holes | ||
| Vias In pad | |||
| lind/Buried Vias | |||