Circuit Card Assembly(COE): Role and Responsibility
The Circuit Card Assembly organization provides the capital and labor resources neccessary to support regional and national POD build efforts. The role and responsibility of the Circuit Card Assembly COE include the following:
The Circuit Card Assembly COE is responsible for generation of assembly cost and cycle time estimates for POD designs.
Technology roadmaps are provided to all manufacturing organizations outlining process initiatives and technology development neccessary to support the company business base.
The Circuit Card Assembly COE provides actual cost and quality information on all POD design to determine the level of maturity and to identify the need for design or technology improvements.
The Circuit Card Assembly COE maintains design guidelines. Product development engineers ensure that the design community has an absolute understanding of this document.
The Circuit Card Assembly COE provides support for proposal generation.
The Circuit Card Assembly COE is the recommended resource for material procurement.
The Circuit Card Assembly COE communicates core competencies and future capability and informs all producibility engineers regardling this effort. The Circuit Card Assembly training academy also provides training material, as these captbilities become part of the mainstream Circuit Card Assembly process.

1.1 Circuit card assembly: proof-of-design process
Figure 3.8a reflects the Circuit Card Assembly POD process flow. The next section provides the task descriptors, which expand on each step by providing the responsible group and task descriptions.

1.2 Task description
1.2.1 Task 1- Program Assessment and setup
Responsibility: Producibility engineer.
Description: Initial meeting with customer to review requirements, define and understand cost allocations, and provide customer with an overview of the design process and process capabilities. The producibility engineer is the lead for manufacturing and design.

1.2.2 Task 2- System-Level Analysis
Responsibility: Circuit Card Assembly producibility engineer; PWB producibility engineer; parts selection engineering; program electrical, mechanical, systems, and specialty engineering; and manufacturing.
Description: Perform technology trades studies, provide suggested producibility/reliability enhancements, conduct make-or-buy analyses, and define mechanical packaging.
1.2.3 Task 3- Assembly Drawing Creation
Responsibility: CAD, Circuit Card Assembly producibility engineer, programe electrical engineer, and program mechanical engineer.
Description: CAD completes the Circuit Card Assembly assembly drawing. Drawing contains detailed information such as the BOM, views, component lead from information, special notes for hardware and adhesives, component handling, and assembly processes.
1.2.4 Task 4-Assembly readiness preparation
Responsibility: Circuit Card Assembly producibility engineer, Circuit Card Assembly methods, Circuit Card Assembly manufacturing, Circuit Card Assembly process, Circuit Card Assembly test, Circuit Card Assembly assembly, and Circuit Card Assembly quality.
Description: Develop machine programs(i.e.,pick and place, X-ray), order special tooling(i.e., stencils, mpm fixture), complete design methodization, and create any new required component part definitions for the pick-and-place equipment. Solder reflow, pillar house, and air-vac profiles are developed as applicable. In-circuit test programes are generated.
1.2.5 Task 5-Circuit Card Assembly preassembly Review
Responsibility:Circuit Card Assembly producibility engineer, Circuit Card Assembly methods, Circuit Card Assembly manufacturing, Circuit Card Assembly process, Circuit Card Assembly test, Circuit Card Assembly assembly, and Circuit Card Assembly quality.
Description: Circuit Card Assembly methods review assembly flow and special build instructions with assembly operators. Circuit Card Assembly manufacturing provides parts status and communicates exceptions(line shorts and substitutions). Existence of valid documentation, machine programs, and tooling is verified.

1.2.6 Task 6-Circuit Card Assembly preassembly Review
Responsibility: Circuit Card Assembly assembly shop and Circuit Card Assembly producibility engineer.
Description: Complete product assembly build. The producibility engineer should be present during the actual build of the product to address potential issues as they arise on the assembly line. An assembly shop representative will document build issues for the Circuit Card Assembly, producibility engineer, and program team after the assembly review and corrective action assignment.

1.2.7 Task 7- Deliver Product
Responsibility: Circuit Card Assembly assembly shop and Circuit Card Assembly producibility engineer.
Description: In addition to the actual build of the product, the Circuit Card Assembly shop and producibility engineer capture actual DPMO data and build cost(when available), as well as any ideas for future design enhancements. The Circuit Card Assembly producibility engineer schedules a "post assembly review" follow-up meeting.

1.2.8 Task 8- Program Follow-UP
Responsibility: Circuit Card Assembly producibility engineer, Circuit Card Assembly methods, Circuit Card Assembly manufacturing, Circuit Card Assembly process, Circuit Card Assembly test, Circuit Card Assembly assembly, Circuit Card Assembly quality, PWB producibility engineer, and program engineer.
Description: A review of the assembly build by the entire POD process team. The exit review covers the following:
--Assembly DPMO score--predicted versus actual: The Circuit Card Assembly PDE presents the prddicted score, and Circuit Card Assembly quality provides the actual DPMO value. When there are significant variances in the predicted versus actual scores, a corrective action plan is developed and agreed upon by the POD team.
--Cost performance: Actual costs are compared to the budgeted build cost on all POD assembly efforts. The Circuit Card Assembly assembly shop provides actual cost.(Cost performance will be reviewed when Circuit Card Assembly part number cost data is available.)

--Circuit Card Assembly nonrecurring engineering effort: A review of the nonrecurring engineering activity takes place at this process step prior ot transitioning the design to production. The subject matter pertaining to this review includes in-circuit test, documentation, and a review of any required tooling. Any item deemed deficient by either Circuit Card Assembly manufacturing or the producibility engineers must be addressed, with a corrective action plan developed and approved by the POD team membership.

Figure 3.9 shows the design flow, Figure 3.10 illustrates the Circuit Card Assembly readiness flow, figure 3.11 is the check sheet of a Circuit Card Assembly readiness kickoff. Figure 3.12 is the readiness kickoff review template. Figure 3.13 is the preassembly review. Figure 3.14 is the preassembly review template. Figure 3.15 shows that post assembly review meeting remplate. Finally we get to Figure 3.16, the post assembly review. Figure 3.17 is a template for the Circuit Card Assembly process check sheet.
Figure 3.18 illustrates the old way things were transitioned to manufacturing based on traditional cultures and the response from the manuafacturing operation. In some cases, we have improved the system to an extent, and we are now at the point where we have started to build bridges(Figure 3.19)