Printed circuit in the basic concepts of the beginning of this century has been raised in the patent, 1947, American Airlines and the United States Bureau of Standards Board launched the first printed circuit technology will be discussed at that time listed 26 different types of printed circuit manufacturing methods . And to be grouped into six categories: coating method, coating method, chemical deposition, vacuum evaporation, and powder molding method. At that time, these methods have failed to achieve large-scale production until the early 50's, as the copper foil And the laminate bond issues have been settled, Copper laminates stable and reliable performance, and achieve large-scale industrial production, copper foil etching method, the PCB manufacturing technology into the mainstream of development has been so far. In the 1960s, metal hole Of double-sided printing and multi-layer printed circuit board to achieve a large-scale production, collection in the 1970s large-scale integrated circuits and computer and the rapid development of the area on behalf of the 80 years of the 1990s technology and the installation of multi-chip assembly of the rapid development of technology Promoted the production of printed circuit board technology continues to progress, a group of new materials and new equipment, new testing equipment have emerged one after another. The production of printed circuit further surgery to high-density, fine wire, high-rise, high reliability and low cost automation Continuous production of direction.
From the mid of 1950s China begans to develop a single-sided PCB. Semiconductor initially for the radio. Self-reliance in the 1960s to the development of China's review board foil substrate so that the copper foil etching method become the leading PCB Production Process. In the 1960s has been able to produce large quantities and single-panel, small batch production of metal-hole double-sided printing, and a small number of units in the development of MLB. Domestically in the 1970s to promote the graphics Etched Plating Process However, due to various disturbances, printed circuit materials and special equipment not in time to keep up with the entire production technology lags behind the advanced level. By the 1980s, due to reforms and opening-up policy approved cited not only with the introduction of a large number of Foreign advanced standards of the 1980s, single-sided, double-sided, multi-layer printed circuit board production line, and more than a decade after digestion and absorption, rapid increase of China's production of printed circuit technology.
Since 1990, Hong Kong, Taiwan and Japan and other foreign PCB manufacturers have come to set up wholly owned or joint ventures in China so that China's PCB production and increase production and develop quickly. 1995 National Printed Circuit Industry Association conducted a national survey, a national survey of 459 printed circuit board manufacturers, including 128 state-owned enterprises, collective enterprises, 125, 86 joint ventures, private enterprises, 22 foreign Enterprise 98. PCB total output has reached 16,560,000 square meters, of which two-panel for 3,620,000 square meters, 1,240,000 square meters for MLB, the total sales of 90 billion yuan (about 11 billion U.S. dollars). IPC Association of the United States and China, including information published in 1994 in Hong Kong printed circuit sales of 11.7 billion U.S. dollars, accounted for 5.5 percent of the world's total, ranking fourth in the world in production technology, as a result of the introduction of a large number of foreign advanced equipment and advanced Production technology, greatly reducing the gap and abroad, has made great progress. However, China's PCB Most of the smaller businesses, the per capita annual sales and industrial all-personnel labor productivity low, low skill levels.